Since China’s National Day is approaching, we’d like to inform you that we’ll have an eight-day holiday from Oct. 1st to Oct. 8th (GMT+8) during which your question or email may not be replied immediately. However, quotation or orders can be submitted online as usual.

In order not to get your manufacturing efficiency reduced, we strongly suggest you submit quotation or order in advance so that manufacturing can be done or started at least before our public holiday. We’ll be back at your service on Oct 9th.


For PCB orders, please kindly calculate the lead date before you place the order. Some orders cannot be finished before our holiday and will be delayed to October.

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Elements that should be Carefully Considered on BGA Assembly Process Capability

BGA assembly is totally compatible with soldering assembly technology. Pitch of chip-scale BGA can be 0.5mm, 0.65mm or 0.8mm and plastic or ceramic BGA components feature wider pitch like 1.5mm, 1.27mm and 1mm. B ...

Impedance Design Considerations for Flex-Rigid PCB

Discusses how to meet rigorous impedance control accuracy in the perspective of PCB design and is expected to be beneficial to staff serving for PCB manufacturing industry. ...

Antenna Design Considerations in IoT Design

Discussion on how to design perfect antenna for IoT devices. ...

Effect of Badly-Performed Solder Mask-Plugged Vias on Via Copper of PCB and Solutions

Cause of badly-performed solder mask-plugged vias on via copper of PCBs and how you can avoid them. Reach PCBCart for perfect printed circuit boards. Get online PCB Quotation now. ...

Setbacks and Solutions in RF PCB Design

Discussion about the most commonly-seen problems in RF circuit design and how you can solve them. Reach PCBCart for a FREE RF PCB fabrication quote. ...

Can't-Miss Layout Tips for BGA Chips

Demonstrate some important layout rules for BGA chips so that optimal soldering effect can be obtained in SMT (surface mount technology) assembly. Reach PCBCart for a FREE BGA SMT Assembly Quote! ...

Impedance Control of Vias and Its Influence on Signal Integrity in PCB Design

An overview about how via impedance control affect signal integrity. Accordingly, this article gives some advice on PCB design. Reach PCBCart for cost-effective PCB fabrication service with strict impedance control. ...

Factors Affecting the Quality of BGA Assembly

Introduction on factors affect the application of BGA assembly technologies including BGA pad design, solder paste printing, mounting alignment accuracy, soldering temperature curves and soldering defects. ...

Optimal Design and Solder Paste Printing Compatible with QFN Component Mounting

Essential Advantages of QFN over other types of components. This article also gives PCB pad design tips and solder paste printing technology to ensure QFN components mounting success. ...

How to Make the Best of Through-Hole Technology (THT) in High-Speed PCB Design

Introduction on Through-Hole Technology (THT), and how PCB designers can make the best of it in high-speed circuit design ...
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